In development Low Dielectric Insulating Coating Materials: RX-8-SP/SA/SB Series

Features and Properties

  • “RX-8-SP/SA/SB Series” contains novel thermosetting polymers different from PFAS or polyimide moieties.
  • The thermoset coating films exhibit Excellent Flexibility, Chemical Resistance, Heat Resistance, Low Dielectric Properties & Insulating Properties.
  • The product specification is adjustable with variation for end-use applications, and we contribute to helping the customers designing of advanced products.

Details of Functions

Example of Chemical Properties

Table 1. Chemical properties of the RX-8-SP/SA/SB Series

Item Features
Appearance Colorless, transparent, and highly viscous liquid
Solid Content Maximum of 70 wt%
SolventsHigher alcohol, hydrocarbon, high boiling point ether, etc.
Toxicity Does not contain perfluoroalkyl groups
Coating Conditions Drying: 100°C for 30 minutes
Curing: 200 – 220°C for 60 minutes
Fig. 1. Exterior appearance of RX-8-SP

Physical Properties of Cured Coating Film

Table 2. Physical properties of cured coating film with the RX-8-SP/SA/SB Series

Item FeaturesCompliance Standards
Appearance of Coating Film
(Visual)
Colorless Proprietary Standards
Coating Film Transparency
(Visible light range)
≥ 85% ASTM D1746
Insulation Breakdown Voltage
(Film thickness: 10 μm)
2KVASTM D149
Dielectric Properties ε2.4 (1 GHz)
2.3 (10 GHz)  
ASTM D2520
tan δ≤ 0.01 (1 GHz)
≤ 0.01 (10 GHz)  
ASTM D2520
Bending Workability No peeling off from the copper adhesive surface JIS K 5600-5-1
(ø5 Mandrel Test)
Adhesion No peeling off from various substrate
(Cu, Si, SiO2 etc. )
JIS K 5600
(Cross-cut Test)
Heat Resistance
(Maintains 95% weight)
220°C for 500 hours (in the air)
430°C for 2 hours (inert atmosphere)
Proprietary Standards
(Weight loss)

Fig. 2. Examples of films cured using RX-8-SP

Coated copper plate
Coated glass plate
180° bending coated copper plate
90° bending coated copper wire
Winded coated copper wire

Mechanical Properties of Cured Coating Film

Fig. 3. Tensile test of cured coating film with the RX-8-SP/SA/SB Series

Graph of Tensile test of cured coating film with the RX-8-SP/SA/SB Series

Measurement Conditions
Measurement temperature: 25°C, Distance between gauges: 30 mm, Tensile Speed: 5 mm/minute, Film thickness: 100 μm

Examples of Heat Resistance Evaluation

Fig. 4. Heat resistant test of cured coating film with the RX-8-SP/SA Series (Temperature: 220℃, substrate: Copper, Film thickness: 20 μm)

Graph of Heat resistant test of cured coating film with the RX-8-SP/SA Series