NIPPON SHOKUBAI announces developing Semiconductor Encapsulating Material with Extreme Heat Resistance
NIPPON SHOKUBAI CO., LTD. [Tokyo Stock Exchange – TOKSE:4114.T]
(“NIPPONSHOKUBAI”) hereby announces that NIPPON SHOKUBAI has
developed a new Semiconductor Encapsulating Material with Extreme Heat
Resistance using its own nano-hybrid technology*). The new product is
expected to be an essential material for SiC power semiconductor
device. NIPPON SHOKUBAI has already started supplying a prototype
sample and is engaged in establishing a mass production process of the
new product.
SiC power semiconductor has the advantage of realizing less electric
loss and smaller device volume than conventional Si power
semiconductors. Power semiconductor devices are widely used in many
applications to control electric usage, however among them, SiC power
semiconductor device is especially expected as the most useful one to
achieve lower electric power consumption and lower CO2 emission
society, and its global market is estimated to expand rapidly with the
spread of solar power cell, wind power generator and electric
automobiles. For SiC power semiconductor, an encapsulating material
having a long term heat resistance over 250℃ has been required as one
of the most important constituent materials.
NIPPON SHOKUBAI has developed a series of thermosetting nanocomposite
resins**) by using its proprietary Nano-Hybrid technology*). Their
molecular structure was designed in controlling chemical interactions
between organic polymers and inorganic nanomaterials so that the
nanocomposite resins can exhibit not only an excellent heat resistance
having glass transition temperature (Tg) of over 250℃ but also
excellent mechanical properties and insulating properties. Moreover,
NIPPON SHOKUBAI’s unique curing system was applied to the
nanocomposite resins to crosslink each nanomaterial independently from
the crosslinking of the resins. This achieves a construction of
interpenetrating network (IPN) in the cured articles, which
contributes to increase significantly the heat resistance to a long-
term high temperature exposure.
Based on the fundamental technologies as mentioned above, NIPPON
SHOKUBAI has developed a new Semiconductor Encapsulating Material with
Extreme Heat Resistance with its original formulation technology for
maximizing the excellent features of nanocomposite resins. NIPPON
SHOKUBAI is prepared to supply both liquid materials for casting and
solid materials for transfer-molding***), to cope with any kinds of
mounting methods.
NIPPON SHOKUBAI will proceed to optimize the characteristics of the
new product by meeting each costumer’s needs and aim at a early
commercialization of Heat-Resistant Encapsulating Material for SiC
power semiconductor.
*) nano-hybrid technology ： A technology for preparing a uniform
compound on a scale of a nanometer (1:1,000,000,000), obtained by
blending or molecularly fusing organic chemicals and inorganic
chemicals. This may exhibit unique characteristics that organics only
or inorganic only can never achieve, if preparation succeed.
**) nanocomposite resin：A uniform resin obtained by single-dispersing
inorganic nanomaterials in polymers. In general, inorganic
nanomaterials are easy to aggregate and it is technically difficult for
producing nanocomposite resins to disperse a single nanoparticle into
organic polymers.
***) transfer-molding：One of the manufacturing method for electronic
devises. In a hot mold with electronic part inside, molten solid
encapsulating materials are mechanically injected and cured, to produce
molded electronic devises. This manufacturing method is widely used
for producing many kinds of electronic devises in bulk in a short time.
Contacts
Investor & Public Relations Dept., NIPPON SHOKUBAI CO., LTD.
TEL: +81-3-3506-7477 E-mail: shokubai@n.shokubai.co.jp