Product Information at SEMICON Japan 2025 ---------The exhibition ended with success! ------------
Introduced Proprietary Materials that Contribute to Improving Semiconductor Performance!
SEMICON Japan was held in 2025 as an international exhibition showcasing the electronics manufacturing supply chain covering manufacturing technologies, equipment and materials in the semiconductor industry as well as SMART applications such as automotives and IoT devices.
Nippon Shokubai’s vision for the future is to provide materials and solutions that meet the need of people and society. We will contribute solutions to customer issues by adding new functions to the semiconductor field through our unique chemistry.
At our company booth, which was our first exhibit, we introduced chemical materials that meet customer needs under 3 themes.
Exhibited Products
Materials for 3D Integration
In response to growing needs for high performance and low power consumption, semiconductor packaging technology is accelerating toward three-dimensional packaging. Nippon Shokubai will contribute to 3D Integration through two types of materials that enhance the performance of increasingly fine-patterned redistribution layers.
Our silica fine particles are known for their narrow particle distribution and uniform particle size, and a low dielectric grade has been developed through a novel manufacturing process. It reduces transmission loss and contributes to improving the performance of fine-patterned redistribution layers.
We introduced the AOMA™ series, a material for insulating resins that exhibits both toughness and flexibility and is effective in preventing cracks after integration.
【Exhibited Products】
Silica Fine Particles(* Opens the Silica Fine Particles (SEAHOSTAR™) page)
Cyclopolymerizable monomer AOMA™ Series
Materials for Cleaning, Etching and Polishing
By enhancing the performance of wet-process chemical solutions, the yield, reliability, and precision of semiconductor microfabrication are improved, resulting in higher performance, lower power consumption, and longer life.
Nippon Shokubai, which has a lineup of acrylic acid-based polymers and polyethyleneimine, is also developing materials for wet-process chemical solutions.
We introduced unique surfactants and high-performance polymer materials applicable for cleaning solutions, etching solutions, and post-CMP cleaning solutions.
【Exhibited Products】
Acrylic Acid-based Polymers
Nonionic Surfactant
Polyvinylpyrrolidone
Polyethyleneimine, Polyethyleneimine Derivatives
Materials for Photolithography
Photolithography is a microfabrication technology. Material selection is also crucial in fabricating circuit & interconnect patterns that enable downscaling of a dramatically complicated structure.
The AOMA™ series, a novel material with a high Tg and higher adhesion than conventional materials, is expected to contribute to reducing delamination and improving morphology stability of patterned films in photolithography.
【Exhibited Products】
Cyclopolymerizable monomer AOMA™ Series
Please feel free to contact us here if you have any inquiries about the exhibit items.