Acrylic Rubber Microparticle-Dispersed Epoxy Resin : ACRYSET™ BP Epoxy Resin with Dispersed Acrylic Rubber Microparticles

  • Main Applications

    Adhesives, Sealing materials, Laminated plates, Composite materials, Paints, etc.

  • Applications
  • Functions

Basic Information

The ACRYSET™ BP series of products are epoxy resins with a sea-island structure before curing.
Nippon Shokubai’s proprietary acrylic rubber microparticles are evenly dispersed in bisphenol A epoxy resin and bisphenol F epoxy resin, which improves brittleness – the main defect of epoxy resin-cured products. It also eliminates variations in physical properties caused by curing conditions and reduced heat resistance, which are seen in the conventional technology of liquid rubber modified epoxy resin-cured products.
This means products cured using the ACRYSET™ BP series are highly resilient with little internal stress, and excellent adhesive force and crack resistance, making them suitable for use in various applications.

TEM photo of products cured using the ACRYSET™ BP series

Features and Properties

  • Toughness
  • Heat-resistant (around 180-200℃)
  • Significantly eases internal stress
  • Strong adhesive force
  • Excellent durability
  • Excellent crack resistance

Uniform Dispersion of Acrylic Rubber in Epoxy Resin

Cavitation of rubber particles strengthens the cured material

Lineup

Item Number Base Epoxy Resin Appearance Viscosity
(Pa·s, 25 ℃)
Epoxy Equivalent
(g/eq.)
Acrylic Rubber Content (phr)
BPA328Bisphenol A TypeWhite, viscous liquid60 ±20230 ±1020 ±1
BPF307Bisphenol F TypeWhite, viscous liquid13 ±5210 ±1020 ±1

Applications

For use with various epoxy resins that require heat resistance and toughness

Semiconductor encapsulants, electronic laminates, printed wiring boards
Structural bonding
CFRP matrix resin

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