In development Low Dielectric Insulating Coating Materials: RX-8-SP/SA/SB Series
- Main Applications
Materials for use in electronics, Semiconductor packaging and in-vehicle parts, Optical materials
- Applications
- Functions
Features and Properties
- “RX-8-SP/SA/SB Series” contains novel thermosetting polymers different from PFAS or polyimide moieties.
- The thermoset coating films exhibit Excellent Flexibility, Chemical Resistance, Heat Resistance, Low Dielectric Properties & Insulating Properties.
- The product specification is adjustable with variation for end-use applications, and we contribute to helping the customers designing of advanced products.
Details of Functions
Example of Chemical Properties
Table 1. Chemical properties of the RX-8-SP/SA/SB Series
| Item | Features |
|---|---|
| Appearance | Colorless, transparent, and highly viscous liquid |
| Solid Content | Maximum of 70 wt% |
| Solvents | Higher alcohol, hydrocarbon, high boiling point ether, etc. |
| Toxicity | Does not contain perfluoroalkyl groups |
| Coating Conditions | Drying: 100°C for 30 minutes
Curing: 200 – 220°C for 60 minutes |
Physical Properties of Cured Coating Film
Table 2. Physical properties of cured coating film with the RX-8-SP/SA/SB Series
| Item | Features | Compliance Standards | |
|---|---|---|---|
| Appearance of Coating Film
(Visual) | Colorless | Proprietary Standards | |
| Coating Film Transparency
(Visible light range) | ≥ 85% | ASTM D1746 | |
| Insulation Breakdown Voltage
(Film thickness: 10 μm) | 2KV | ASTM D149 | |
| Dielectric Properties | ε | 2.4 (1 GHz)
2.3 (10 GHz) | ASTM D2520 |
| tan δ | ≤ 0.01 (1 GHz)
≤ 0.01 (10 GHz) | ASTM D2520 | |
| Bending Workability | No peeling off from the copper adhesive surface | JIS K 5600-5-1
(ø5 Mandrel Test) | |
| Adhesion | No peeling off from various substrate
（Cu, Si, SiO2 etc. ） | JIS K 5600
(Cross-cut Test) | |
| Heat Resistance
(Maintains 95% weight) | 220°C for 500 hours (in the air)
430°C for 2 hours (inert atmosphere) | Proprietary Standards
(Weight loss) | |
Fig. 2. Examples of films cured using RX-8-SP
Mechanical Properties of Cured Coating Film
Fig. 3. Tensile test of cured coating film with the RX-8-SP/SA/SB Series
Measurement Conditions
Measurement temperature: 25°C, Distance between gauges: 30 mm, Tensile
Speed: 5 mm/minute, Film thickness: 100 μm
Examples of Heat Resistance Evaluation
Fig. 4. Heat resistant test of cured coating film with the RX-8-SP/SA Series (Temperature: 220℃, substrate: Copper, Film thickness: 20 μm)
