Hybrid Monomers VEEA™, VEEM™ Hybrid monomers

Basic Information

VEEA™: 2- (2-Vinyloxyethoxy)ethyl acrylate
VEEM™: 2- (2-Vinyloxyethoxy)ethyl methacrylate (under developing)

Illustration of Chemical Structure

(1) Radical polymerizable (meth)acryloyl group

  • Polymerization is not inhibited by water and bases
  • Has many co-polymerizable monomers
  • Has no dark reaction

(2) Cationic polymerizable vinyl ether group

  • Polymerization is not inhibited by oxygen
  • Good dilutability
  • Good adhesion
VEEA™VEEM™
CAS No.86273-46-376392-22-8
Molecular FormulaC9H14O4C10H16O4
Molecular Weight 186.20200.23
Appearance Colorless and transparent liquidColorless and transparent liquid
Boiling Point 115 – 116°C/13.3 hPa122 – 123°C/13.3 hPa
Specific Gravity1.04g/mL(15℃)1.03 g/mL (15°C)
Viscosity 3.65 mPa·s3.19 mPa·s
SolubilityH2O:18g/L(30℃)
Organic solvent: Dissolve arbitrarily
H2O:2.2g/L(30℃)
Organic solvent: Dissolve arbitrarily

Features and Properties

  • VEEA™ and VEEM™ are monomers with unique structures having different types of polymerizable functional groups in one molecule: radical polymerizable (meth)acryloyl groups and cationic polymerizable vinyl ether groups.
  • By selecting the polymerization method, unique polymers with (meth)acryloyl or vinyl ether groups as pendant groups can be obtained.
  • VEEA™ and VEEM™ have excellent UV curability as monomers.

Polymerization Method

Illustration of Chemical Structure

Details of Functions

Reactive diluent

  • VEEA™ and VEEM™ can be used as a reactive diluent for heat, UV and EB curable inks.
  • VEEA™ and VEEM™ are less sensitive to curing inhibition by oxygen in the air, and even thin films (several microns)
Illustration of Chemical Structure

UV Curing Properties of VEEA™

Run No.123
VEEA™100
DEGDA10053.53
DEGDV46.47
Irgacure907111
UV curing
performance (1)
0.1 J/cm2
0.2 J/cm2
0.3 J/cm2+++
0.4 J/cm2+++
0.5 J/cm2+++
UV curing
performance (2)
1 pass++
2 pass++
3 pass++
4 pass++
5 pass++

UV curing performance (1): UV irradiation equipment: PM25C-100 (USHIO Inc.) 250 W ultra-high pressure mercury vapor lamp (main wavelength = 365 nm), thickness: 300 μm, surface tackiness: judged by finger touch (++ = tack-free, — = uncured) (++ = tack-free, — = not cured)

UV curing performance (2): UV irradiation device: UB031-5BM (EyEGRAPHICS), 80 W high pressure mercury vapor lamp, thickness: 30 μm, line speed: 14 m/min, distance from light source: 10 cm, irradiation energy per pass: 125 mJ/cm2, Irradiation energy per pass: 125 mJ/cm2, Surface tackiness: Tack-free to the touch (++ = tack-free, — = not cured)

UV curing properties of VEEA™ and VEEM™ as reactive diluents

Run No.456789
Unsaturated polyester resins606060
Bis A type epoxy resin 606060
VEEA™4040
VEEM™4040
DEGDA4040
Irgacure907111111
Viscosity (mPa・s @ 25℃)110210382670295289855
UV curing
performance
1 pass+
2 pass+++++
3 pass++++++
4 pass+++++++++
5 pass+++++++++++
7 pass+++++++++++
Pencil Hardness (JIS K-5400)FHBBFFF
Acetone rubbing (100times)++++++++++++

UV curing performance: UV irradiation device: UB031-5BM (EYEGRAPHICS Co., Ltd.) with 80 W high-pressure mercury lamp;
Thickness: 30 μm, Line speed: 14 m/min, Distance from light source: 10 cm, Irradiation energy per pass: 125 mJ/cm2, Surface tackiness: determined by finger touch (++ = tack free, — = uncured) Pencil hardness: measured after 10 passes curing. Acetone rubbing: measured after 10 passes curing

Polymer with a pendant Vinyl Ether Group

Thermal, UV, and EB curable polymers are obtained by radical or anionic polymerization.

Illustration of Chemical Structure

Polymer with a pendant (Meth)Acryloyl Group

Thermal, UV, and EB curable polymers are obtained by cation polymerization.

Illustration of Chemical Structure

Derivatives

Various acetals can be synthesized by addition reaction to vinyl ether groups.

Illustration of Chemical Structure

Examples of Applications

  • Coatings: Wood coatings, Film coatings, Hard coatings, Optical disk coatings, Optical fiber coatings, etc.
  • Ink: Inkjet inks, Screen inks, Offset inks, Gravure inks, etc.
  • Photo Resists: Dry film resist, Semiconductor resist, Photosensitive resin plate, etc.
  • Adhesives
  • Stereo-lithography
    etc.

Utilities

Illustration of Utilities

Catalog